標籤: BT4.1

Raytac MDBT42Q-P512K評価サンプル出荷開始

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 
(nRF51822 & nRF51422 & nRF52832 & nRF51802)
www.raytac.com
Tel: +886.2.3234.0208
email: service@raytac.com
日本での代理店への連絡は下記の通り。
株式会社フクミ (Fukumi corporation)
消費材企画開発Gr. LBTチーム　（Consumer Products R&D Group, LBT team)
榊　和優　（Kazumasa Sakaki)
Tel : 03-5687-2890 (+81-3-5687-2890)
Mail : lbt_bt@fukumi.co.jp
ブログから引用。詳細は下記Link先へ。

http://bluetooth.tokyo/raytac-mdbt42q-p512k%E8%A9%95%E4%BE%A1%E3%82%B5%E3%83%B3%E3%83%97%E3%83%AB%E5%87%BA%E8%8D%B7%E9%96%8B%E5%A7%8B-360.html

先に出荷が開始されたMDBT42Q-512Kとはアンテナの違いだけです。
品番に「P」が付くとPCBのパターンアンテナ（通信距離目安６０M)で、
「P」が付かないとチップアンテナ（通信距離目安８０M）となります。
■MDBT42Q　概要
SoC：nRF52832
BT ver ：BT4.2
Size : 16 x 10 x 2.2mm
Flash memory : 512kB
RAM : 64kB
Antenna : Chip Antenna (MDBT42Q-512K) / Printed Antenna (MDBT42Q-P512K)
評価サンプルをご希望される場合ですが、
メニューの「お問い合わせ」もしくは「見積依頼」よりお願い致します。

iBeacon VS. Eddystone

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Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 

(nRF51822 & nRF51422 & nRF52832 & nRF51802)

www.raytac.com

Tel: +886.2.3234.0208

email: service@raytac.com  

http://raytaccorp.blogspot.tw/2016/07/ibeacon-vs-eddystone.html

http://bluetooth.tokyo

What is Eddystone

Eddystone is the standard for the beacon using the BLE that Google announced in July 2015.

It is available includes a number of broadcast frame types on all platforms that use the BLE, such as iOS as well as Android open standards, designed to give developers and venue owners flexibility in their beacon developments and applications. Eddystone helps beacons using the Proximity Beacon API, including adding attachments in the cloud and monitoring their health.

https://developers.google.com/beacons/

Feature

Eddystone’s biggest feature is not intended to become a black box such like iBeacon service, works only for iOS. Eddystone program code is designed to be an open standard and has been published in GitHub.

The difference between iBeacon and Eddystone is the “broadcast frame type"

iBeacon transmits ID only (1 Type)

Eddystone transmits not only ID, but also URL and TLM. (3 Types)

Unlike iBeacon, Eddystone provides target users to receive the message through URL without app installing as long as the Bluetooth is turned on. 

Packet

Eddystone is allowed to transmit 17 bytes every packet.

Thus, in case of URL broadcast frame type, the data must be downsize to fit in this 17 bytes limitation

User Scence Example

  • Real time Bus location and operation status
  • Approaching or nearby the poster, the URL link will pup up feeding immediately
  • Nearby Restaurant information feeding.
  • Nearby Shops information feeding

Eddystone is designed to compensate the demerit of iBeacon’s, which is standardization.

However, iBeacon so far is still the most well-known and widely applied service right now as well as iPhone is the most well selling single mobile phone all over the word. 

Thus, the trend of which one will prevail the competition between Eddystone Vs. iBeacon is still a interesting topic and lead the delimma for developers and user to observe closely.

MDBT42 Module (Nordic nRF52832 Solution) Now Launched

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 

(nRF51822 & nRF51422 & nRF52832 & nRF51802)

www.raytac.com

Tel: +886.2.3234.0208

email: service@raytac.com  

http://raytaccorp.blogspot.tw/2016/07/mdbt42-module-nordic-nrf52832-solution.html

http://bluetooth.tokyo

MDBT42, based on Nordic nRF52832 WL-CSP solution, is about to be armed and targeting for IoT industry.

Raytac’s module line in 2016 now has become ready and all well loaded.

Nordic Semiconductor launches the most advanced, high-performance single chip Bluetooth low energy SoC in a tiny package size

Targeting next-generation wearables and space-constrained IoT applications, the nRF52832 Wafer Level Chip Scale Package (WL-CSP) has a super-compact 3.0 by 3.2mm footprint that occupies one quarter of the footprint area of Nordic’s standard 6.0 by 6.0mm QFN48-packaged nRF52832, yet offers the same full feature set

Oslo, Norway 2016/07/05

Nordic Semiconductor today announces the availability of a Wafer Level Chip Scale Package (WL-CSP) variant of its nRF52832 Bluetooth® low energy (formerly known as Bluetooth Smart) System-on-Chip (SoC) that occupies a quarter of the footprint area of the standard-packaged Nordic nRF52832 and targets next-generation, high-performance wearables and space-constrained IoT applications.

The nRF52832 WL-CSP has a super-compact 3.0 by 3.2mm footprint compared to the standard 6.0 by 6.0mm footprint of its larger but conventionally-packaged nRF52832 QFN48 cousin, yet offers the same full single-chip feature set and best-in-class, ultra-low-power application operation. This includes a powerful on-board 64MHz ARM® Cortex®-M4F processor that enables protocol and application task processing to be completed in unprecedentedly short time-frames, thus allowing power-saving sleep modes to be entered much quickly compared to competing devices.

Like the nRF52832, the nRF52832 WL-CSP features: 512kB Flash and 64kB RAM; on-chip NFC™ tag for consumer-friendly Touch-to-Pair; best-in-class ultra-high performance, ultra-low-power multi-protocol Bluetooth low energy, ANT™, and proprietary 2.4GHz radio; 5.5mA peak RX/TX currents; an on-chip RF Balun; plus a unique fully-automatic power management system that makes achieving optimal power consumption easy for designers.

The nRF52832 WL-CSP is compatible with Nordic’s Bluetooth 4.2 stacks and supporting SDKs including the latest S132 multi-role concurrent software stack, nRF5 SDK, nRF5 SDK for HomeKit, and nRF5 SDK for AirFuel (resonant wireless charging).

“The availability of a super-compact footprint nRF52832 brings new design opportunities to wearables and other space-constrained IoT applications,” comments Kjetil Holstad, Product Manager Ultra Low-Power Wireless at Nordic Semiconductor. “And this SoC is available now in high production volumes for immediate inclusion in upcoming product development.”

Holstad adds: “The evolution of wearables to date has only ever gone one way: ever increasing performance and functionality in ever-slimmer, lighter, form factors. The nRF52832 WL-CSP is by a clear margin, the smallest and most advanced Bluetooth low energy SoC available on the market today.”

About Bluetooth 5

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 

(nRF51822 & nRF51422 & nRF52832 & nRF51802)

www.raytac.com

Tel: +886.2.3234.0208

email: service@raytac.com  

http://raytaccorp.blogspot.tw/2016/06/about-bluetooth-5.html

http://bluetooth.tokyo

Simple Summary

Scheduled to be released in end or 2016 or early 2017

1.Quadruples range

Extending range will deliver robust, reliable Internet of Things (IoT) connections that make full-home and building and outdoor use cases a reality. The expect power consumption of BT5  is expected to remain the same level as BT4.2. 

BT4.2: 10~100M

BT5.X: Upto 400M

2.Doubles speed

Higher speeds will send data faster and optimize responsiveness. Increasing broadcast capacity will propel the next generation of “connectionless” services like beacons and location-relevant information and navigation.

BT4.2: 1M bit/Sec

BT5.X: 2M bit/Sec

3. Data broadcasting capacity by 800%

Bluetooth 5,will quadruple range and double speed of low energy connections while increasing the capacity of connectionless data broadcasts by 800%. 

According to SIG’s news press

 “Increasing operation range will enable connections to IoT devices that extend far beyond the walls of a typical home, while increasing speed supports faster data transfers and software updates for devices. And now with the ability to broadcast a much richer set of information, Bluetooth 5 will make beacons, location awareness, and other connectionless services an even more relevant part of an effortless and seamless IoT experience” 

“With the major boost in broadcast messaging capacity, the data being transferred will be richer, more intelligent. This will redefine the way Bluetooth devices transmit information, moving away from the app-paired-to-device model to a connectionless IoT where there is less need to download an app or connect the app to a device."

To redefine the behavior of moving away from app-paired-to-device model must bring a revolutionary user behavior and environment from 2017. That is the most critical point for all product design or related Bluetooth industry need to pay highly attention!

Steps to Qualify Your Bluetooth Products

發表於 由撰寫發表留言
Raytac Corporation
A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 
(nRF51822 & nRF51422 & nRF52832 & nRF51802)
www.raytac.com
Tel: +886.2.3234.0208
email: service@raytac.com  
http://raytaccorp.blogspot.tw/2016/06/steps-to-qualify-your-bluetooth-products.html
http://bluetooth.tokyo
To qualify a Bluetooth product always the issue make people headache.
Here, we summarized the procedure become simple steps to help readers to easy to follow
From Step 3~5, we are sincerely suggest readers to entrust BQB (Bluetooth Qualify Body) to provide the professional service to save time and energy according to our experience.

STEP 1 Become a membership

https://www.bluetooth.com/membership-working-groups/why-how-to-become-a-member
Adopter Membership: Free–> “Most customers pick"
Associated Membership: US$7,500 or US$35,000 (depends on company size)
For more detail of the benefit between different membership, please visit the link as below
https://www.bluetooth.com/membership-working-groups/membership-types-levels

STEP 2. Obtain Production Information from supplier or manufacturer

Make sure your chip supplier or module manufacturer has well certified or not.
All information can be refer to SIG’s QDID information in public.
Makes sure the supplier or manufacturers’ QDID has well certified including both Hardware and Profile QDID

STEP 2-1. Qualify Your Products

a. Customers can log in SIG’s website to create a project in Test Plan Generator.
b. Pick up the type of qualification, such as End Product/Subsystem/Component/Development tool/Test equipment…etc.)
c. Link Layer, Spec, Profile

STEP 3. Purchase the Declaration ID (DID)

Readers can buy the DID from SIG’s website directly.

STEP 4. Submit Qualification Document

The Qualification Documents must been signed by BQE (Bluetooth Qualify Engineer) by BQB

STEP 5. Create and Submit the qualification

STEP 6. Brand Your Bluetooth Product

 

Raytac BLE モジュールMDBT40/MDBT40-PはJASO規格 D001-94に適合

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 
(nRF51822 & nRF51422 & nRF52832 & nRF51802)
www.raytac.com
Tel: +886.2.3234.0208
email: service@raytac.com
http://jpble.blogspot.tw/2016/06/raytac-ble-mdbt40mdbt40-pjaso-d001-94.html
日本での代理店への連絡は下記の通り。
株式会社フクミ (Fukumi corporation)
消費材企画開発Gr. LBTチーム　（Consumer Products R&D Group, LBT team)
榊　和優　（Kazumasa Sakaki)
Tel : 03-5687-2890 (+81-3-5687-2890)
Mail : lbt_bt@fukumi.co.jp
株式会社フクミのブログから引用。詳細は下記Link先へ。

http://bluetooth.tokyo/

NordicのnRF51824がAEC-Q100のテストに適合した記事の内容を以前投稿しましたが、
RaytacのBLEモジュールMDBT40とMDBT40-PシリーズはJASO（自動車技術会）が制定した
自動車用電子機器の環境試験の規格をクリアしています。
試験の概要は以下の通り。
１．低温下でも問題なく動作する（-30℃を72時間）
２．高温下でも問題なく動作する（85℃を120時間）
３．サーマルショックテスト（-40℃～85℃）
４．温度サイクルテスト（-40℃～85℃）
上記環境下で基本的な動きが確認でき、データのパケットロスがない事を確認します。
D001-91-1
D001-91-2
D001-91-3

Raytac Module MDBT40/MDBT40-P Certified Automotive Standard JASO D001-94

發表於 由撰寫發表留言
Raytac Corporation
A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 
(nRF51822 & nRF51422 & nRF52832 & nRF51802)
www.raytac.com
Tel: +886.2.3234.0208
email: service@raytac.com  
http://raytaccorp.blogspot.tw/2016/06/raytac-module-mdbt40mdbt40-p-certified.html
http://bluetooth.tokyo
Along with Nordic nRF51824 is qualified to the automotive AEC-Q100 stress test qualification, Raytac’s Module MDBT40-256V3 & MDBT40-P256V3 also has been qualified in reliability test based on automotive standard JASO D001-94.
 
1. Operating under low temperature test (-30℃  for 72 hrs)
2. Operating under high temperature test (85℃  for 120 hrs)
3. Thermal Shock Test (-40℃ ~85℃ )
4. Temperature Cycling Test(-40℃ ~85℃ )
 
During the JASO D001-94 testing, the module is based on working status and confirmed not data or package loss during the whole testing.

Nordic 新SoC nRF51824提供開始

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 

(nRF51822 & nRF51422 & nRF52832 & nRF51802)

www.raytac.com

Tel: +886.2.3234.0208

email: service@raytac.com

日本での代理店への連絡は下記の通り。

株式会社フクミ (Fukumi corporation)

消費材企画開発Gr. LBTチーム　（Consumer Products R&D Group, LBT team)

榊　和優　（Kazumasa Sakaki)

Tel : 03-5687-2890 (+81-3-5687-2890)

Mail : lbt_bt@fukumi.co.jp

株式会社フクミのブログから引用。詳細は下記Link先へ。

http://bluetooth.tokyo/

Nordic Semiconductorはコネクテッドカーに対応するnRF51824 Bluetooth Low Energy Socの

提供を開始したようです。

特に注目すべきは車載用集積回路向けのストレス信頼性試験AEC-Q100に合格した製品で

パフォーマンスとしてはnRF51822と同等だということです。

現在急速に進化を続け注目されている自動車分野への

強力なソリューションになることが期待されますね。

コネクテッドカーでの具体的な例といえば…

インテリジェントシート、ハンドル、ミラー、リモートキーレスエントリー等の車載装備関係や

情報システム、事故防止関係の予防・回避システム等でユーザーの利便性・安全性への

向上に寄与するのではないでしょうか？

また、エンジン回りでのケーブル類の置き換えで、

重量の軽減による燃費向上も期待できます。

そんなnRF51824はサンプル出荷を開始しており、6×6の48ピンQFNパッケージで供給されます。

nRFgo Studioのバージョンについて

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 

(nRF51822 & nRF51422 & nRF52832 & nRF51802)

www.raytac.com

Tel: +886.2.3234.0208

email: service@raytac.com

日本での代理店への連絡は下記の通り。

株式会社フクミ (Fukumi corporation)

消費材企画開発Gr. LBTチーム　（Consumer Products R&D Group, LBT team)

榊　和優　（Kazumasa Sakaki)

Tel : 03-5687-2890 (+81-3-5687-2890)

Mail : lbt_bt@fukumi.co.jp

株式会社フクミのブログから引用。詳細は下記Link先へ。

http://bluetooth.tokyo/

nRFgoはNordic社が提供する開発用スタートキットです。

（内容）

2x nRFgo motherboards

2x USB cables

4x 10-ribbon flat cables

8x 2-lead patch cables

1x nRFgo display add-on module

Printed ‘Getting Started Guide’

＊Digi key等で5万円程度で購入が出来ます。

今回は開発したファームウェアをモジュールに焼きこむためのソフトウェアnRFgo Studioについて

Tipsです。

現時点（2016年6月7日）では、最新バージョンが「1.21．2」となっていますが、

Raytac社が比較検証したところ「1.19.x」のバージョンが書き込み速度が一番早いようです。

生産時にnRFgoとnRFgo Studioを使用して大量にコーディングをしている場合は特にですが、

余計なコストを発生させない為にも以前のバージョン1.19.xを使用したいところです。

環境依存こそあるかもしれませんが、最新バージョンが優れているという概念を捨て

以前のバージョンも保持しておくことが必要だという事ですね。

Bluetooth SIG メンバーについて

發表於 由撰寫發表留言

Raytac Corporation

A BT4.1 & BT4.2 module maker based on Nordic nRF51 & nRF52 solution 
(nRF51822 & nRF51422 & nRF52832 & nRF51802)
www.raytac.com
Tel: +886.2.3234.0208
email: service@raytac.com
http://jpble.blogspot.tw/2016/06/bluetooth-sig.html
日本での代理店への連絡は下記の通り。
株式会社フクミ (Fukumi corporation)
消費材企画開発Gr. LBTチーム　（Consumer Products R&D Group, LBT team)
榊　和優　（Kazumasa Sakaki)
Tel : 03-5687-2890 (+81-3-5687-2890)
Mail : lbt_bt@fukumi.co.jp
株式会社フクミのブログから引用。詳細は下記Link先へ。

http://bluetooth.tokyo/

Bluetoothのロゴを使用するためには
まずはSIGのメンバーになるのが前提ですが、
基本的には2つのメンバーが用意されています。
簡易的に説明しますと…
①アダプターメンバー
・参加費用無料
・DIDの購入費用 USD8,000 (下記表 Listing fee部分)
・テストツールのディスカウント無し　等々
②アソシエイトメンバー
・年会費USD7500(売上高USD100M未満)or USD35,000(売上高USD100M以上)
・DIDの購入費用 USD4,000
・テストツールのディスカウントやマーケティング情報等へのアクセス可　等々
詳しくは下記表が違いになります。
もし売上がUSD1M未満で過去SIGへのリスティングを行っていない場合は、
Innovation Incentive Programの適用が可能となり、USD2,500で最初のDID取得が可能です。
（DID取得から18カ月以内に使用しない場合は無効となります）
年間で2件以上登録を考えている場合はアソシエイトメンバーの方がお得ですね。